Equipment : Nanofab Sputtering System #5

Overview

  • Five targets, RF or DC, 5" or 75 mm
  • Single substrate, 1" 2" and 3" wafer
  • Load lock
  • Programmable substrate positioning
  • Variable target-substrate distance
  • 8" cryo pump
  • Separate pumping system for oxidation (e.g. for tunnel junctions)
  • 500 W DC power supplies, 600 W RF power supplies, substrate bias
  • Secondary sputtering gas available

Available Targets: Please discuss with the staff.

Please consult Nanofab staff for process specifics.

Tool image(s)