Equipment : Kulicke & Soffa 782-6 Dicing Saw

Overview

  • Handles up to 6" wafers, maximum 800 μm thick
  • Materials diced: Si, Glass, Quartz, SiC, Sapphire, LiNbO3
  • Kerf width down to 50 μm (blade dependent)
  • DI water blade cooling and rinsing

Please consult Nanofab staff for process specifics.

Tool image(s)