Equipment : Cambridge Nanotech Fiji ALD System

Overview

  • Atomic layer deposition system with load lock
  • Any substrate up to 200 mm wafer
  • Plasma enhanced ALD available with O2, Ar, and N2 gases
  • Thermal ALD with temperatures up to 300°C
  • Turbo pump with APC
  • Up to 3 precursors plus water available

Available Materials: Al2O3, SiO2, HfO2, TiO2, Pt, Ru.

Please consult Nanofab staff for process specifics.

Tool image(s)