Equipment : IPC Barrel Etcher

Overview

  • Typically used for descumming photoresist and removing organics from wafer surfaces.
  • My also be used for isotropic etching of polysilicon and nitride using Poly-Etch 907.

Available Gases: O2, N2, Poly-Etch

Please consult Nanofab staff for process specifics.

Tool image(s)