Equipment : STS Aspect Advanced Oxide Etcher (AOE)
- One of two process chambers on the Aspect cluster tool
- Advanced Oxide Etch process
- 3 kW coil power supply, 1 kW platen power supply
- 12 wafer cassette, 150 mm wafers
- Two loadlocks, central wafer dealer
Note: Staff approval must be given EVERY TIME this machine is to be used.
Available Gases: CF4, C4F8, O2, Ar, He
Please consult Nanofab staff for process specifics.