Kulicke & Soffa 782-6 Dicing Saw
Overview- Handles up to 6" wafers, maximum 800 μm thick
- Materials diced: Si, Glass, Quartz, SiC, Sapphire, LiNbO3
- Kerf width down to 50 μm (blade dependent)
- DI water blade cooling and rinsing
Please consult Nanofab staff for process specifics.
