Carnegie Mellon University
Cambridge Nanotech Fiji ALD System

  • Atomic layer deposition system with load lock
  • Any substrate up to 200 mm wafer
  • Plasma enhanced ALD available with O2, Ar, and N2 gases
  • Thermal ALD with temperatures up to 300°C
  • Turbo pump with APC
  • Up to 3 precursors plus water available
Available Targets: Al2O3, SiO2, HfO2, TiO2, Pt, Ru.
Please consult Nanofab staff for process specifics.