Carnegie Mellon University

Kurt Lesker PVD 75 Sputtering System

Overview
  • Load-lock with auto transfer
  • 6” wafer capability
  • 6 targets (3” diameter)
  • Co-sputtering up to 4 sources
  • 800C substrate heater
  • RF or DC sputtering
  • RF sputter etch on substrate
  • Computer automation
Please consult Nanofab staff for process specifics.