Carnegie Mellon University

Plasma-Therm 790 RIE

  • Typically used for etching oxide, nitride, and silicon
  • 500 W RF power supply
  • 6" water cooled sample table

Note: Staff approval must be given EVERY TIME this machine is to be used.

Available Gases: SF6, CF4, CHF3, O2, Ar.
Please consult Nanofab staff for process specifics.