Carnegie Mellon University

STS Aspect Advanced Oxide Etcher (AOE)

  • One of two process chambers on the Aspect cluster tool
  • Advanced Oxide Etch process
  • 3 kW coil power supply, 1 kW platen power supply
  • 12 wafer cassette, 150 mm wafers
  • Two loadlocks, central wafer dealer

Note: Staff approval must be given EVERY TIME this machine is to be used.

Available Gases: CF4, C4F8, O2, Ar, He.
Please consult Nanofab staff for process specifics.