Carnegie Mellon University

STS Aspect ICP RIE

Overview
  • Bosch process license for anisotropic silicon etch
  • Isotropic silicon etch
  • RIE with Inductively Coupled Plasma
  • 1200 W coil power supply, 300 W platen power supply
  • Four wafer carousel, 4" wafers
Note: Staff approval must be given EVERY TIME this machine is to be used.

Available Gases: SF6, C4F8, O2, Ar.
Please consult Nanofab staff for process specifics.